Embedded Copper Foil: The “Invisible Integrator” of Electronic Circuits Domestic Substitution Activates New Track

The embedded resistance copper foil is not a traditional single-function copper foil but a new material that integrates resistance function with the copper foil substrate through innovative technology. Specifically, it uses pure copper as the base material, forming a coating with specific resistance characteristics after special surface treatment, ultimately achieving a deep integration of resistance function and conductive substrate, becoming an embedded passive electronic component. This unique structure allows it to achieve resistance function on the circuit board without additional plugins, offering a feasible solution for thinning and lightening electronic devices.

Demand Driven by Technological Iteration

In recent years, rapid iterations in technologies like 5G communication, artificial intelligence, and the Internet of Things (IoT) have driven the high-speed development of electronic information technology. As the "neural network" of electronic devices, printed circuit boards (PCBs) are facing new requirements for miniaturization, ease of packaging, high density, high frequency, and high speed. Traditional discrete resistors, capacitors, and other passive components, which take up significant space, have become bottlenecks for high integration of PCBs. The embedded resistance copper foil, characterized by the integration of resistance and copper foil, precisely matches the development trend of PCB and becomes a key technology for improving integration levels.

Core Structure and Process Characteristics

The core structure of the embedded resistance copper foil is composed of a dielectric layer and a resistance layer. In this seemingly simple structure, parameters like sheet resistance value and peel strength (the adhesion strength between the coating and the copper foil) directly affect the stability and machining accuracy of the PCB, making them key indicators determining its performance. In practical applications, four main preparation methods have been formed based on process differences: metal etching method (high precision), chemical nickel-phosphorus deposition method (controllable cost), magnetron sputtering metal method (suitable for high-end scenarios), and screen printing conductive carbon paste method (flexible process). Each of these methods has its advantages and can meet the customized needs of diverse electronic devices.

Multi-Field Applications Unleash Potential

Consumer Electronics: Devices such as smartphones, tablets, and wearables are evolving towards lighter and more multifunctional forms. The application of embedded resistance copper foil can reduce the use of discrete resistors, saving circuit board space (aiding in light and thin devices), lowering signal transmission loss, and enhancing operating speed and stability. For instance, adopting this technology in smartphones can further reduce the motherboard size while optimizing signal processing capabilities, ensuring smoother user operation and more stable network connections.

Communication Equipment: Devices like 5G base stations and microwave integrated circuits have strict performance requirements. Embedded resistance copper foil, with its excellent electrical and thermal conductivity, can ensure the stability of high-speed signal transmission and help solve equipment heat dissipation issues, supporting the efficient operation of 5G networks. In 5G base station antennas, this material can improve signal transmission and reception efficiency, expand coverage, and enhance network stability.

Automotive Electronics: The rapid development of new energy vehicles and intelligent connected vehicles drives the increasing demands for integration, reliability, and safety of in-vehicle electronic systems. When applied to key components like onboard radars, autonomous driving control systems, and battery management systems, embedded resistance copper foil can optimize circuit design, reduce electromagnetic interference, and enhance overall system performance. For example, in onboard radars, it can improve signal processing accuracy, helping vehicles more accurately sense the environment, thereby supporting the safety of autonomous driving.

Aerospace and Military: These fields have extremely high requirements for material performance, requiring a balance of electrical, thermal conductivity, and adaptability to extreme environments. With characteristics like anti-static, high adhesion, and strong weather resistance, embedded resistance copper foil can be used in high-speed aircraft shells, avionics equipment, military communication equipment, and other scenarios, ensuring stable operation in complex environments. For example, its use in high-speed aircraft shells can effectively suppress electromagnetic interference and static issues, ensuring safety during ultra-high-speed flight.

Supply and Demand: Opportunities and Challenges Coexist

Demand Side: The rapid development of industries such as smartphones, automotive electronics, and communication equipment continuously drives the market demand for embedded resistance copper foil. The growth of the global smartphone market and the increase in 5G phone penetration drive the demand for high-performance, miniaturized circuit boards, thereby boosting the demand for embedded resistance copper foil; the explosive growth in sales of new energy vehicles and the expansion of onboard electronic systems also lead to a surge in demand for embedded resistance copper foil; the acceleration of the construction of communication facilities like 5G base stations and microwave equipment similarly injects momentum into the market.
Supply Side: Embedded resistance copper foil is a technology-intensive material, especially nano-composite copper foil, which has very high requirements for production processes and research and development capabilities. There are very few companies worldwide capable of large-scale, high-quality production. Although domestic progress has been made in electronic materials, embedded resistance copper foil still relies heavily on imports, and the capacity for domestic mass production is insufficient. Changes in the international landscape further exacerbate supply uncertainties, highlighting supply chain security risks.

Future: Technological Breakthroughs and Domestic Substitution Are Key

Looking ahead, the market potential for embedded resistance copper foil is significant but comes with challenges. On one hand, continuous innovation in electronic information technology and the increasing performance requirements of electronic devices will create more market space for embedded resistance copper foil. The development of the IoT, leading to a demand for billions of interconnected devices, will generate massive demand for miniaturized, high-performance circuit boards, with embedded resistance copper foil expected to be widely used in IoT devices. On the other hand, the widespread environmental concept promotes the upgrade of materials' environmental performance. If production processes can be optimized to reduce energy consumption and pollution, they will better align with green development trends, enhancing market competitiveness.

Domestic companies are actively investing in research and development, breaking through technological bottlenecks through independent innovation and industry-university-research collaboration. Some companies have made progress in the preparation technology of embedded resistance copper foil, such as developing proprietary preparation processes, achieving uniform and stable resistance layers through equipment and process innovation, with precision control reaching the domestic leading level, and collaborating with multiple leading CCL and PCB manufacturers to advance mass production. Other companies have showcased innovative products at international exhibitions, driving the domestic substitution of high-end copper foil through technological breakthroughs. However, it should be noted that there are still gaps between the domestic industry and international advances in terms of technological research depth, production scale, and product quality stability. Further enhancement of core technology capabilities and production scale is needed to meet market demand.