C7025 is a precipitate reinforced alloy with high strength and medium conductivity, good formability and stress relaxation resistance. It is mainly used in various kinds of consumer electronic connectors, automotive connectors and high-speed connectors. Buy copper strip at Jintian group, an established copper strip supplier, we are pleased to await your inquiry for copper-nickel-silicon strip price.
Cop-ni-si alloy has good resistance to high temperature softening and thermal stress relaxation, which can improve the reliability of devices at high temperature
Copper-nickel-silicon alloy has good surface quality and uniform precipitation phase dispersion, which can improve the electroplating quality of products in the subsequent process.
Copper-nickel-silicon alloy has good bending performance, which can meet the requirements of subsequent stamping.
Chemical Composition of C7025
The main elements | Cu | Ni | Si | Mg |
Content / % | Rem. | 2.2-4.2 | 0.25-1.2 | 0.05-1.3 |
Physical Properties of C7025
The density of | 8.8 | g/cm3 |
Conductivity @ 20 ℃ | P 42 | %IACS |
Thermal conductivity @ 20 ℃ | 190 | W/(m • K) |
Specific heat capacity | 0.39 | J/g • K) |
Poisson's ratio | 0.33 | - |
Modulus of elasticity | 130 | GPA |
Surface roughness | 17.6 | um |
Mechanical Properties of C7025
state | Hardness/HV | Tensile strength /MPa | Yield strength /MPa | Elongation/A50% |
TM00 | 180-200. | 580-650. | P 500 | 11 or higher |
TM02 | 190-220. | 650-730. | P 580 | 7 or higher |
TM03 | 210-240. | 670-800. | P 645 | 5 or more |
TM04 | 230-250. | 740-840. | P 680 | 3 or higher |
Bending Performance of C7025
state | 90 ° R/T | |
Good Way | Bad Way | |
TM00 | 0 | 0 |
TM02 | 1 | 1 |
TM03 | 1.5 | 1.5 |
TM04 | 2 | 2 |
Reply: ASTM B422: 2010
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