Standard Designation: BZn12-26 (Nickel Silver)
Applicable Standard: GB/T 5231-2012 (Wrought Copper and Copper Alloys)
International Equivalent Grades: ASTM C75720, JIS C7452
Material Category: Copper-Nickel-Zinc Ternary Alloy (Cu-Ni-Zn), containing 59.0%-62.0% Copper, 11.0%-13.0% Nickel + Cobalt, with the remainder being zinc (approximately 25%-30%).
1. Balance of High Strength and Corrosion Resistance:
Tensile strength ≥ 380 MPa (annealed), up to 650 MPa (hardened). Excellent seawater corrosion resistance (corrosion rate ≤ 0.008 mm/a).
2. Excellent Processing Performance:
Good cold and hot working performance, supporting processes such as deep drawing, stretching, and electroplating, with a surface finish of up to Ra 0.4 μm.
3. Outstanding Electromagnetic Shielding:
Electrical conductivity ≥ 6% IACS, with electromagnetic shielding effectiveness (SE ≥ 60 dB @ 1 GHz), making it suitable for precision electronic enclosures.
4. Environmental Compatibility:
Lead content ≤ 0.03%, in compliance with RoHS directive requirements.
Element | Cu | Ni+Co | Zn | Fe | Mn | Total Impurities |
Content (%) | 59.0-62.0 | 11.0-13.0 | Remainder (approximately 25%-30%) | ≤0.3 | ≤0.5 | ≤0.8 |
Performance Parameters | Values | Remarks |
Density | 8.65 g/cm³ | Advantages of Lightweight Design |
Electrical conductivity | 6%-8% IACS | Meets General Requirements for Electrical Conductivity and Shielding |
Thermal Conductivity | 38 W/(m·K) | Moderate Heat Dissipation Capability |
Coefficient of Linear Expansion | 16.5×10⁻⁶/℃(20-300℃) | Excellent Thermal Stability |
Magnetism | Weak Magnetism (μr ≈ 1.02) | Suitable for Applications in Non-Magnetic Environments |
Performance Parameters | Annealed (M) | Hardened (H04) |
Tensile Strength (σb) | ≥380 MPa | 600-750 MPa |
Elongation Rate (δ10) | ≥20% | ≥3% |
Vickers Hardness (HV) | ≤120 | 180-220 |
Elastic Modulus | 130 GPa | Material Rigidity Index |
Corrosion Resistance: 30%-50% lower corrosion rate than brass in seawater, humid atmospheres, and weak acids.
Surface Treatment Adaptability: Supports various surface treatments such as nickel plating, gold plating and passivation, enhancing both functionality and aesthetics.
High Cost-Performance Ratio: 40%-60% lower cost than pure nickel alloys, ideal for large-scale industrial applications.
1. Electronics Industry:
5G Communication Equipment: RF connector housings and base station shielding covers (EMI shielding and weather resistance).
Consumer Electronics: High-end headphone jacks and smart watch casings (surface plating compatibility).
2. Marine Engineering:
Seawater Desalination Equipment: Valve components and pump body liners (resistance to chloride ion corrosion).
3. Precision Machinery:
Optical Instruments: Lens mounts and precision gears (dimensional stability and wear resistance).
4. Automotive Industry:
New Energy Vehicles: Charging interfaces and battery connection pieces (balance of conductivity and corrosion resistance).
Annealing Process: After cold working, anneal at 650-750℃ for 1-2 hours to restore plasticity.
Cutting Parameters: Cutting speed should not exceed 50 m/min, using carbide tools, and the coolant must contain anti-adhesion additives.
Welding Requirements: It is preferable to use laser welding or electron beam welding to avoid grain boundary corrosion associated with traditional welding methods.
Electroplating Process: The thickness of the pre-plated nickel layer should be ≥ 3μm to ensure the adhesion of subsequent gold/silver layers.
A: BZn12-26 has a higher zinc content (25%-30% vs. 21%-26%), offers slightly better strength and corrosion resistance, but has lower electrical conductivity (6%-8% vs. 7% IACS).
A: The recommended long-term operating temperature is ≤150℃, while it can tolerate short-term exposure up to 250℃; temperatures exceeding 300℃ will significantly soften the material.
A: Control the mold gap to be 8%-12% of the material thickness, maintain a stamping speed of ≤30 strokes per minute, and apply a lubricant (such as a PTFE coating) after annealing.
Chemical Composition and Processing Specifications: GB/T 5231-2012, ASTM B122 (American Standard for Plates).
International Standards: JIS H3130 (Japanese Standard), ISO 426-2 (International General Standard).
Note: The data above is compiled from national standards and industry technical documents; actual performance may vary slightly due to production processes, and specific results should be based on the supplier's test report.
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