C19210 and C19400 are mainly used in semiconductor lead frame industry. This series of alloy has good electrical conductivity and high temperature softening resistance, and excellent material surface quality, which can improve packaging reliability and stability. Friends who need to buy copper strip, welcome to contact us.
Lead frame material has good strength, electrical conductivity, thermal conductivity and other comprehensive performance, can meet the design requirements of lead frame industry.
The lead frame material has good performance of softening at high temperature and resisting thermal stress relaxation, which can improve the reliability of devices under working conditions.
Lead frame material surface quality is excellent, with good plating and weldability, for the subsequent processing technology to provide convenience.
Semiconductor Lead Frame: Leadframe strip, like c19400, is essential for semiconductor packaging, providing electrical connections and heat dissipation for integrated circuit chips.
Lead Frame (Stamping): Versatile and cost-effective option used in electronics, automotive, and consumer goods for connectors, relays, switches, and sensors.
Lead Frame (Etching): Precise and intricate designs for microelectronics, offering accurate positioning and connections for microchips and sensors.
Automotive Applications: Copper lead frame is vital in automotive industry for electronic control units (ECUs), airbags, engine management systems, and sensors.
Telecommunications and Consumer Electronics: Found in components like connectors, switches, relays, and LEDs, ensuring reliable signal transmission and power distribution.
The main elements | Cu | Fe | P |
Content / % | Rem. | 0.05-0.15 | 0.025-0.04 |
The density of | 8.9 | g/cm3 |
Conductivity @ 20 ℃ | 89 | %IACS |
Thermal conductivity @ 20 ℃ | 350 | W/(m • K) |
Specific heat capacity | 0.385 | J/g • K) |
Poisson's ratio | 0.33 | - |
Modulus of elasticity | 125 | GPA |
Surface roughness | 0.12 or less | um |
state | Hardness/HV | Tensile strength /MPa | Yield strength /MPa | Elongation/A50% |
1/4H | 100-120. | 310-380. | 280-350. | 15 or more |
1/2H | 110-130. | 350-420. | 300-390. | 5 or more |
H | 120-135. | 390-460. | P 350 | 3 or higher |
EH | 130-150. | 420-490. | P 400 | 1 or more |
Chemical composition of C19400
The main elements | Cu | Fe | P |
Content / % | Rem. | 2.1-2.6 | 0.015-0.15 |
Physical properties of C19400
The density of | 8.8 | g/cm3 |
Conductivity @ 20 ℃ | 66 | %IACS |
Thermal conductivity @ 20 ℃ | 280 | W/(m • K) |
Specific heat capacity | 0.385 | J/g • K) |
Poisson's ratio | 0.33 | - |
Modulus of elasticity | 121 | GPa |
Surface roughness | 0.12 or less | um |
Mechanical properties of C19400
state | Hardness/HV | Tensile strength /MPa | Yield strength /MPa | Elongation/A50% |
1/2H | 115-135. | 370-430. | 320-420. | 10 or higher |
H | 125-145. | 420-470. | P 390 | 5 or more |
EH | 135-150. | 460-505. | P 440 | 2 or more |
SH | 140-160. | 485-525. | - | 2 or more |
JIS H3110: 2018
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