By Types
By Application
C11000 (UNS C11000, ASTM B152/B187, ISO CW004A)
Also known as phosphorized copper or ETP copper (Electrolytic Tough Pitch), with a minimum copper content of 99.90% and trace oxygen (≤0.06%).
Exceptional electrical conductivity (~100% IACS), ideal for electrical applications.
High thermal conductivity (394 W/m·K), suitable for heat exchangers and cooling systems.
Excellent ductility and formability, enabling cold working and complex shaping.
Good corrosion resistance in atmospheric and aqueous environments.
Susceptible to "hydrogen embrittlement" in high-temperature (>370°C) reducing atmospheres.
Product Form | Thickness/Diameter (mm) | Width (mm) | Length (mm) |
Sheet/Strip | 0.08 – 6.0 | 8.5 – 600 | Custom |
Rod | 3.0 – 50.0 | – | 1000 – 6000 |
Wire | 0.5 – 12.0 | – | Custom |
Tube | OD: 5.0 – 100.0 | – | Custom |
Custom dimensions available based on application requirements. | |||
Element | Cu + Ag | O | Sn | Zn | Pb | Fe | Others |
Content | ≥99.90% | ≤0.06% | ≤0.002% | ≤0.005% | ≤0.005% | ≤0.005% | ≤0.10% |
Impurities (e.g., Bi, Sb, S) are strictly controlled to maintain conductivity and workability39. | |||||||
Property | Value |
Density (g/cm³) | 8.9 |
Melting Point (°C) | 1083 |
Thermal Conductivity (W/m·K) | 394 |
Electrical Conductivity (% IACS) | 100 |
Coefficient of Thermal Expansion (10⁻⁶/°C) | 17.0 (20–300°C) |
High purity ensures minimal resistance to electrical and thermal transfer. | |
Condition | Tensile Strength (MPa) | Yield Strength (MPa) | Elongation (%) | Hardness (HRB) |
Annealed (Soft) | 220 – 275 | 180 | 45 – 50 | 35 – 45 |
Cold Worked (Hard) | 275 – 345 | 250 – 300 | 5 – 10 | 60 – 80 |
Mechanical properties vary with processing methods (e.g., annealing or cold working). | ||||
Ultra-high conductivity for electrical and thermal systems.
Superior formability for intricate designs in electronics and machinery.
Cost-effective alternative to silver in conductive applications.
Resistance to atmospheric corrosion for long-term durability.
Electrical: Wiring, busbars, connectors, transformers.
Thermal Management: Heat exchangers, radiators, solar heating components.
Industrial: Pipes, fasteners, stamped parts.
Aerospace: Conductive components and heat dissipation systems.
Machining: Use sharp tools with low cutting speeds and lubrication to prevent overheating.
Welding: Avoid high-temperature reducing environments (e.g., hydrogen-rich) to prevent hydrogen embrittlement.
Annealing: Perform at 500–700°C to restore ductility after cold working.
Forming: Suitable for cold rolling, bending, and stamping due to high ductility.
High-current electrical transmission systems (e.g., power grids).
Precision electronic connectors in consumer devices.
Corrosion-resistant plumbing and marine fittings.
A: Trace oxygen reacts with hydrogen in reducing atmospheres, forming water vapor that causes micro-cracks.
A: C11000 has slightly lower conductivity (~100% IACS vs. 101% for OFHC) but is more cost-effective for general applications.
A: Yes, but avoid processes involving hydrogen (e.g., gas welding). Soldering or brazing is preferred.
ASTM: B152 (sheet/strip), B187 (rod/bar).
ISO: CW004A (wrought copper designation).
GB/T: 4423-1992 (Chinese standard for processing).
Note: Properties may vary slightly based on manufacturing processes. Always verify specifications with certified test reports.
Tel:
E-mail:
Address:
No.1 Chengxi West Road, Cicheng, Ningbo, China
English
한국어
français
Deutsch
Español
italiano
العربية
tiếng việt
Türkçe
ไทย
中文