SF-Cu Copper

Designation

SF-Cu (Phosphorus-Deoxidized Copper)

International Standards: DIN 1708 2.0090, GB/T 2059-2000, CW004A (EN 13601).

1. High Purity: Cu ≥99.90%, P 0.005–0.040%, O ≤0.03%, total impurities ≤0.05%.

2. Superior Conductivity: Electrical conductivity 57.0–58.0 Ω*mm²/m (annealed state).

3. Hydrogen Embrittlement Resistance: Low oxygen content prevents hydrogen disease.

4. Workability: Excellent cold/hot working performance (drawing, forging).

5. Corrosion Resistance: Stable in chemical and marine environments.

Form	Dimensions
Rod	Diameter: 10–300mm; Length: 2000–6000mm
Tube	OD: 5–200mm; Wall Thickness: 0.5–10mm
Sheet/Strip	Thickness: 0.1–80mm; Width: 100–1200mm
Wire	Diameter: 0.05–10mm; Custom lengths
Foil	Thickness: 0.005–0.5mm; Width: 10–500mm
Custom profiles available (e.g., lead frames).

1. High Conductivity & Hydrogen Resistance: Ideal for vacuum devices and H₂ brazing.

2. Precision Machining: Fine-grained structure minimizes deformation.

3. Thermal Stability: Suitable for high-temperature applications (up to 920°C).

1. Cold Working: Anneal at 500–700°C (under N₂/Ar protection).

2. Hot Working: Temperature range 750–875°C, final rolling ≥600°C.

3. Welding: Avoid reducing atmospheres >370°C; use silver-based filler.

Industry	Typical Components	Requirements
Mold Manufacturing	Stamping dies	High surface precision, fatigue resistance
Power Transmission	HV cable conductors	High current capacity, low resistance
Vacuum Industry	Magnetron anodes	Low gas emission, high-temperature brazing

A1: SF-Cu has controlled phosphorus (0.005–0.040%) for enhanced hydrogen resistance.

A2: Store in dry environments (≤40% RH) to prevent oxidation.

Standard	Scope
DIN 1708	Chemical composition & codes
GB/T 2059	Chinese specifications for sheets/strips
EN 13601	European rod/wire technical conditions
ASTM B152	U.S. specifications for sheet/strip