Cu-DLP is a deoxidized, oxygen-free copper with a low residual phosphorus content. It combines very good formability and joining properties.
Cu-ETP | Cu | P | Bi | Pb |
min 99.90 | 0.005-0.013 | max 0.0005 | max 0.005 |
Aerospace, machinery industry, water plant, gas and oil industry, valve industry, shipbuilding industry.
/ | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation | Hardness |
R200 | 220-260 | ≤140 | ≥33 | 40-65 |
R240 | 240-300 | ≥180 | ≥8 | 65-95 |
R290 | 290-360 | ≥250 | ≥4 | 90-110 |
R360 | ≥360 | ≥320 | ≥2 | ≥110 |
Melting point | Density | cp@20°C | Coefficient of Thermal Expansion | Young modulus |
1083°C | 8.94g/cm³ | 0.377 kJ/kgK | 17.7 10-6 /K | 132 GPa |
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