C11000 Copper

Grade Name

C11000 (UNS C11000, ASTM B152/B187, ISO CW004A)
Also known as phosphorized copper or ETP copper (Electrolytic Tough Pitch), with a minimum copper content of 99.90% and trace oxygen (≤0.06%).

Product Features

Exceptional electrical conductivity (~100% IACS), ideal for electrical applications.
High thermal conductivity (394 W/m·K), suitable for heat exchangers and cooling systems.
Excellent ductility and formability, enabling cold working and complex shaping.
Good corrosion resistance in atmospheric and aqueous environments.
Susceptible to "hydrogen embrittlement" in high-temperature (>370°C) reducing atmospheres.

Common Product Forms & Dimensions

Product Form	Thickness/Diameter (mm)	Width (mm)	Length (mm)
Sheet/Strip	0.08 – 6.0	8.5 – 600	Custom
Rod	3.0 – 50.0	–	1000 – 6000
Wire	0.5 – 12.0	–	Custom
Tube	OD: 5.0 – 100.0	–	Custom
Custom dimensions available based on application requirements.

Copper C11000 Chemical Composition

Element	Cu + Ag	O	Sn	Zn	Pb	Fe	Others
Content	≥99.90%	≤0.06%	≤0.002%	≤0.005%	≤0.005%	≤0.005%	≤0.10%
Impurities (e.g., Bi, Sb, S) are strictly controlled to maintain conductivity and workability39.

C11000 Copper Specification

Physical Properties

Property	Value
Density (g/cm³)	8.9
Melting Point (°C)	1083
Thermal Conductivity (W/m·K)	394
Electrical Conductivity (% IACS)	100
Coefficient of Thermal Expansion (10⁻⁶/°C)	17.0 (20–300°C)
High purity ensures minimal resistance to electrical and thermal transfer.

Mechanical Properties

Condition	Tensile Strength (MPa)	Yield Strength (MPa)	Elongation (%)	Hardness (HRB)
Annealed (Soft)	220 – 275	180	45 – 50	35 – 45
Cold Worked (Hard)	275 – 345	250 – 300	5 – 10	60 – 80
Mechanical properties vary with processing methods (e.g., annealing or cold working).

C11000 Material Core Advantages

Ultra-high conductivity for electrical and thermal systems.
Superior formability for intricate designs in electronics and machinery.
Cost-effective alternative to silver in conductive applications.
Resistance to atmospheric corrosion for long-term durability.

Product Applications

Electrical: Wiring, busbars, connectors, transformers.
Thermal Management: Heat exchangers, radiators, solar heating components.
Industrial: Pipes, fasteners, stamped parts.
Aerospace: Conductive components and heat dissipation systems.

Processing Guidelines

Machining: Use sharp tools with low cutting speeds and lubrication to prevent overheating.
Welding: Avoid high-temperature reducing environments (e.g., hydrogen-rich) to prevent hydrogen embrittlement.
Annealing: Perform at 500–700°C to restore ductility after cold working.
Forming: Suitable for cold rolling, bending, and stamping due to high ductility.

Key Application Scenarios

High-current electrical transmission systems (e.g., power grids).
Precision electronic connectors in consumer devices.
Corrosion-resistant plumbing and marine fittings.

FAQs

Q1: Why is C11000 prone to hydrogen embrittlement?

A: Trace oxygen reacts with hydrogen in reducing atmospheres, forming water vapor that causes micro-cracks.

Q2: How does material C11000 compare to oxygen-free copper (OFHC)?

A: C11000 has slightly lower conductivity (~100% IACS vs. 101% for OFHC) but is more cost-effective for general applications.

Q3: Can C11000 be used for welding?

A: Yes, but avoid processes involving hydrogen (e.g., gas welding). Soldering or brazing is preferred.

Standards & References

ASTM: B152 (sheet/strip), B187 (rod/bar).
ISO: CW004A (wrought copper designation).
GB/T: 4423-1992 (Chinese standard for processing).

Note: Properties may vary slightly based on manufacturing processes. Always verify specifications with certified test reports.