C10100 Copper

Grade Name

C10100 (ASTM Standard), also known as Oxygen-Free Copper (OFC). Purity ≥99.99%, Oxygen Content ≤0.0005%.

Product Features

• Ultra-High Electrical Conductivity (≥101% IACS) and Thermal Conductivity.

• Extremely Low Oxygen Content, eliminating hydrogen embrittlement risk, suitable for high-temperature reducing environments.

• Excellent Cold/Hot Workability with strong ductility.

• Superior Corrosion Resistance, especially in vacuum or inert atmospheres.

Common Product Forms & Dimensions

Product Form	Thickness (mm)	Width/Diameter (mm)	Length (mm)
Plate	0.1~50	50~600	500~6000
Strip	0.05~3.0	10~300	Coil (Customized)
Wire	–	Φ0.1~20	Coil / Straight
Tube	Wall: 0.5~10	Φ5~200	1000~6000

Chemical Composition (%)

Cu	O	Other Impurities (Total)
≥99.99	≤0.0005	≤0.001

Copper C10100 Material Properties

Physical Properties

Density (g/cm³)	Melting Point (°C)	Conductivity (%IACS)	Thermal Conductivity (W/m·K)
8.94	1083	101~103	398

Mechanical Properties

Condition	Tensile Strength (MPa)	Yield Strength (MPa)	Elongation (%)
Annealed (O)	200~220	50~70	≥45
Hard Temper (H)	300~350	280~320	3~8

Core Advantages

• Purity Benchmark: Ultra-low oxygen content reduces grain boundary embrittlement, extending service life at high temperatures.

• Energy Efficiency Optimization: Higher conductivity than standard pure copper (C11000), minimizing energy transmission loss.

• Adaptability for Precision Machining: Suitable for complex processes like stamping, deep drawing, and welding.

Product Applications

• Electronics: Semiconductor lead frames, high-frequency coaxial cables.

• Energy Equipment: Vacuum tube anodes, fusion reactor liners.

• High-End Manufacturing: Superconducting magnet windings, laser cavity cooling components.

Processing Notes

• Annealing: Perform under hydrogen or nitrogen atmosphere (400~600°C) to prevent oxidation.

• Cold Working: Recommended deformation per pass ≤30% to avoid stress concentration and cracking.

• Welding: TIG welding preferred; argon purity ≥99.995%.

Key Application Scenarios (Expanded & Detailed)

① High-Frequency Communication & Electronics

Millimeter Wave Radar Antennas: For 5G base stations & automotive radar, utilizing low signal loss characteristics.

High-Frequency Circuit Substrates: Microstrip line/coplanar waveguide substrates in satellite communication equipment, ensuring high-frequency stability.

② New Energy Vehicles & Charging Infrastructure

Power Battery Tabs/Connectors: High conductivity reduces resistive heating, improving charge/discharge efficiency.

Fast Charger Internal Conductors: Supports high-current transmission, minimizing energy waste.

③ Precision Instruments & Sensors

High-Accuracy Temperature Probes: Thermocouple protection sheaths, resistant to high temperature with uniform thermal conductivity.

MEMS (Micro-Electro-Mechanical Systems) Wiring: Ultra-fine wires (Φ<0.1mm) for micro-sensor interconnects.

④ Renewable Energy Equipment

Photovoltaic Ribbon: Interconnects solar cells, low resistance enhances photovoltaic conversion efficiency.

Wind Power Converter Heat Sink Baseplates: Optimizes thermal management through high thermal conductivity, extending equipment life.

⑤ High-End Consumer Electronics

Hi-Fi Audio Cables: OFC reduces audio signal distortion, enhancing sound purity.

Ultra-Thin Foldable Screen Hinges: High ductility supports precision stamping.

⑥ Special Industrial Equipment

EDM (Electrical Discharge Machining) Electrodes: High purity ensures uniform discharge, achieving surface finishes up to Ra 0.2μm.

Vacuum Deposition Evaporation Sources: Resistant to high-temperature sublimation, enabling high film deposition consistency.

⑦ Emerging Technology Fields

Quantum Computer Superconducting Coils: Maintains stable conductivity in cryogenic environments (-269°C).

3D Printing Metal Powder: Used in Electron Beam Melting (EBM) for printing complex high-thermal-conductivity parts.

Supplemental Note:
The above scenarios leverage the combined "Purity + Conductivity + Workability" advantages of C10100, making it particularly suitable for applications demanding high material reliability, energy efficiency, or precision manufacturing.

Frequently Asked Questions (FAQ)

Q1: What is the difference between C10100 and C10200?

A: C10200 has an oxygen content ≤0.001%, slightly lower conductivity (100% IACS), and lower cost.

Q2: How to store to prevent oxidation?

A: Vacuum packing or nitrogen-filled storage is recommended, with humidity ≤40%RH.

Q3: Is plating supported?

A: Silver/nickel/tin plating is possible; acid cleaning (e.g., 5% sulfuric acid solution) is required first to remove surface oxides.

Standards Reference

• ASTM: B152/B152M (Plate/Strip)

• EN: CW008A (EU Oxygen-Free Copper Standard)

• GB/T: T1 (China Highest Purity Pure Copper Grade)

Note: Specific parameters may vary based on production processes; refer to the factory test report for definitive values.