TU2 Copper

Designation and Standards

• Standard Designation: TU2 (China GB/T 5231-2012)

• International Equivalent Grades:

  ASTM B152: C10100 (Oxygen-Free Copper)

  EN 13601: Cu-OFE (Oxygen-Free Electrolytic Copper)

Product Features

• Ultra-High Purity: Copper content ≥ 99.95%, with minimal impurities and oxygen content ≤ 0.002%.

• Excellent Conductivity and Thermal Conductivity: Conductivity ≥ 101% IACS, Thermal Conductivity ≥ 397 W/(m·K).

• No Hydrogen Embrittlement Risk: Low oxygen content prevents embrittlement in high-temperature reducing environments.

• Superior Workability: Excellent ductility, suitable for stamping, drawing, and welding processes.

Common Product Forms and Dimensions

Product Form	Dimension Range	Surface Condition
Strip	Thickness: 5-50mm; Width: 20-300mm; Length: ≤6m	Smooth/1/2Hard
Plate	Thickness: 0.5-50mm; Width: 100-2000mm	Rolled/Polished
Tube	Outer Diameter: 3-200mm; Wall Thickness: 0.5-15mm	Y/M (Annealed)
Wire	Diameter: 0.1-10mm; Coil Weight: 50-500kg	Bright/Tin-Plated

Chemical Composition

Element	Cu	O	P	S	Total Impurities
Content	≥99.95%	≤0.002%	≤0.001%	≤0.002%	≤0.05%

Physical Properties

Property	Value	Test Standard
Density	8.96 g/cm³	GB/T 3850
Melting Point	1083°C	GB/T 232
Conductivity (20°C)	101-103% IACS	GB/T 3048.2
Thermal Conductivity (20°C)	397-401 W/(m·K)	ASTM E1461
Thermal Expansion Coefficient	16.5×10⁻⁶/°C (20-100°C)	GB/T 4339

Mechanical Properties (Annealed State)

Property	Value	Test Standard
Tensile Strength	200-250 MPa	GB/T 228.1
Yield Strength	60-80 MPa	GB/T 228.1
Elongation (δ)	≥35%	GB/T 228.1
Hardness (HV)	40-60	GB/T 4340.1
Elastic Modulus	110-130 GPa	GB/T 22315

Core Advantages

• Purity Assurance: Ultra-low impurity content ensures stable electrochemical performance.

• High-Temperature Stability: Suitable for vacuum or noble gas environments (e.g., semiconductor manufacturing).

• Corrosion Resistance: Excellent oxidation resistance in dry, sulfur-free environments.

• Processing Flexibility: Supports precision etching, laser cutting, and other complex processes.

Product Applications

Industry	Typical Applications	Key Requirements
Electronics	Integrated circuit lead frames, high-frequency transformer windings	High conductivity, low signal loss
Energy Equipment	Solar cell conductors, nuclear power plant cooling tubes	Radiation resistance, long-term thermal stability
Automotive	EV cooling plates, high-voltage connectors	High thermal conductivity, vibration fatigue resistance
Aerospace	Rocket engine liners, thermal management systems	High-temperature oxidation resistance, lightweight design

Processing Notes

• Cold Working: Intermediate annealing (650-800°C under noble gases) is required if deformation exceeds 30%.

• Welding: Preferably use TIG welding (argon purity ≥ 99.99%) to avoid porosity and oxidation.

• Cutting: Recommend low-speed, high-feed cutting with sulfurized cutting oil to reduce tool wear.

• Surface Treatment:

  Short-term Anti-Oxidation: Apply Benzotriazole (BTA) corrosion inhibitor.

  Long-term Protection: Nickel electro plating (thickness ≥ 5μm) or hot dip tinning.

Key Application Scenarios

• High-Precision Heat Sinks: 5G base station chip heat sinks, IGBT module substrates.

• Vacuum Equipment Components: Coating machine targets, particle accelerator conductive cavities.

• Superconducting Material Carriers: Low-temperature superconducting cable support frames (used in liquid nitrogen environments).

Frequently Asked Questions

Q1: Can TU2 copper replace T2 copper?

TU2 is required for high conductivity/thermal conductivity or vacuum environments, while T2 copper can be used for cost savings in conventional applications.

Q2: How to check if oxygen content is compliant?

Oxygen content is professionally tested using Noble Gas Fusion-Infrared Absorption Method (GB/T 5121.7).

Q3: How to deal with surface oxidation after long-term storage?

Light oxidation can be removed with 5% citric acid solution; severe oxidation requires mechanical polishing and passivation treatment.

Standards Reference

Standard Type	Standard Number	Scope
Chinese Standard	GB/T 5231-2012	Chemical composition, grade definition
American Standard	ASTM B152-20	Dimensions and tolerances for oxygen-free copper products
European Standard	EN 13601:2013	Conductivity and mechanical properties testing methods
International Standard	ISO 1337:2020	Hydrogen embrittlement susceptibility evaluation for high-purity copper

Additional Notes

• Environmental Compliance: Compliant with RoHS 2.0 (Heavy Metal Limits) and REACH SVHC regulations.

• Customization Services: Supports non-standard dimensions, pre-coating (tin/silver/nickel), and other special requirements.

For additional performance curves or application examples, please contact technical support!