JTCOPPER
JTCOPPER
Copper

Cu-HCP Copper

Copper

Features of Cu-HCP Copper

Copper HCP is a deoxidized, oxygen-free copper with a low residual phosphorus content. It combines very good formability, weldability and brazing with high electrical conductivity (minimum 98% IACS).

Chemical Composition of Cu-HCP Copper

Cu-HCP

Cu

PB

Bi

P

Others

99.95

max  0.005

max  0.0005

0.002 – 0.007

total 0.03

 

Application of Cu-HCP Copper

Electrical engineering, power module substrates, process equipment manufacturing and cable industry.

Mechanical Property of Cu-HCP Copper

Tensile strength

200

Yield strength

50

Minimum elongation at break

30

Hardness

40

Resistivity

 0.01754 – 0.01818 Ω*mm²/m

 Physical properties of Cu-HCP Copper

Melting

point

Density

cp@20°C

Coefficient of Thermal Expansion

Young modulus

1083°C

8.94g/cm³

0.377kJ/kgK

17.7 10-6 /K

127 GPa

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