C10300 Copper

Designation

• International Standard: C10300 (ASTM B152)

• Chinese Designation: TU1 (GB/T 5231)

• Alias: Oxygen-Free High Conductivity Copper (OFHC)

Key Features

• High Purity: Copper content ≥99.99%, oxygen content ≤0.0003%.

• Exceptional Conductivity: Electrical conductivity ≥101% IACS (International Annealed Copper Standard).

• Superior Thermal Conductivity: Ideal for heat dissipation applications.

• Low Gas Content: Excellent vacuum sealing performance for high-temperature oxygen-free environments.

• Outstanding Workability: High ductility for deep drawing, wire drawing, and forging.

Common Product Forms & Dimensions

Product Form	Dimensions	Delivery Conditions
Rods	Diameter: Φ5mm–Φ200mm, Length: 1–6m	Hard (H), Half-Hard (1/2H), Annealed (O)
Wires	Diameter: Φ0.1mm–Φ10mm	Straight or coiled
Sheets/Plates	Thickness: 0.1mm–50mm, Width: ≤1200mm	Cold-rolled, Hot-rolled, Annealed
Tubes	OD: Φ3mm–Φ150mm, Wall Thickness: 0.2–10mm	Seamless or welded

Chemical Composition (wt%)

Element	Cu	O	Other Impurities (Total)
Content	≥99.99	≤0.0003	≤0.007

Physical Properties

Property	Value	Test Standard
Density (20°C)	8.94 g/cm³	ASTM B193
Melting Point	1083°C	ASTM E3
Thermal Conductivity (20°C)	391 W/(m·K)	ASTM E1225
Electrical Resistivity (20°C)	1.673×10⁻⁸ Ω·m	ASTM B193
Thermal Expansion (20–300°C)	16.5×10⁻⁶/°C	ASTM E228

Mechanical Properties

Condition	Tensile Strength (MPa)	Yield Strength (MPa)	Elongation (%)	Hardness (HV)
Annealed (O)	200–250	60–80	≥45	40–60
Hard (H)	350–450	300–380	5–15	100–120

Core Advantages

• Ultra-High Purity: Minimizes impurities for optimal conductivity/thermal performance.

• Vacuum Compatibility: Low oxygen content prevents hydrogen embrittlement in high-temperature vacuum environments.

• Superior Ductility: Suitable for precision machining (e.g., semiconductor lead frames).

• Corrosion Resistance: Stable in non-oxidizing acids and alcohol-based media.

Applications

• Electronics & Electrical: High-frequency conductors, vacuum tubes, magnetron components.

• Energy Sector: Solar cell conductive layers, liners for nuclear fusion devices.

• Cryogenics: Ultra-low-temperature pipelines (liquid nitrogen/helium transfer).

• Advanced Manufacturing: 3D printing metal powders, sputtering targets.

Processing Guidelines

• Annealing: Perform under hydrogen or inert gas atmosphere (400–600°C).

• Cold Working: Intermediate annealing required for deformation exceeding 80%.

• Welding: Use TIG welding or electron beam welding to avoid oxidation.

• Storage: Seal packaging to prevent oxidation; avoid contact with sulfides.

Frequently Asked Questions (FAQ)

Question	Answer
How does C10300 differ from regular copper (e.g., T2)?	Lower oxygen content (T2: ≤0.06% O), higher conductivity, and suitability for vacuum environments.
Is it suitable for high-frequency signal transmission?	Yes, high purity minimizes skin effect losses at high frequencies.
How to prevent oxidation during processing?	Use inert gas shielding or vacuum furnaces; clean surfaces post-processing.
Can it be electroplated?	Yes, but requires thorough degreasing and surface activation.

Reference Standards

• ASTM: B152 (Sheet/Strip), B187 (Rods), B272 (Wires)

• GB/T: 5231-2012 (Oxygen-Free Copper), 8888-2021 (Copper Alloy Tubes)

• JIS: H0500 (OFHC Analysis Methods)

• EN: 13601 (General Standards for Copper Alloy Profiles)

Note: Data based on standard annealed (O) condition; actual properties may vary slightly with processing. Refer to factory test reports for specifics.
Date of Preparation: October 2023
Version: V2.1

Let me know if further adjustments are needed!