中文
AIDC Material Solutions
As GPU power consumption keeps rising, liquid cooling has become a must, and the computing power bottleneck is shifting from chip shortages to power and cooling shortages. High-performance, high-power AIDC servers use about 5 to 10 times more copper than traditional servers, and copper's strategic importance keeps growing. For the full-chain construction of AI computing centers, Jintian Copper’s materials are widely used in three core areas: power transmission systems, signal transmission systems, and cooling systems, meeting the needs for high-current power supply, high-speed signal interconnect, and high-density liquid cooling in high-power AI servers.
Application Scenarios
Power Transmission System
For high-power power supply scenarios in AI computing centers, it meets the needs of high current and heavy-load power supply, ensuring stable and reliable power.
- UPS
- HVDC
- BBU
- power supplies
- distribution
- racks
- transformers
Signal Transfer System
Focusing on high-speed signal connections inside servers, achieving low-latency, low-loss transmission, and ensuring stable high-bandwidth, high-speed data exchange.
- PCIe
- DDR
- orthogonal backplanes
- DAC direct-connect copper cables
Thermal‑Cooling System
Adapted for kilowatt-level high-power GPU clusters, covering temperature control needs at all levels—from chip, module, and rack, to the entire data center—improving energy efficiency.
- heat pipes
- VC cold plates
- 3D VC
- liquid cooling plates
- liquid cooling quick connectors
- CDU heat exchange units
- cooling towers
Copper material solution
Copper busbar
- C1100 (Medium-Low Voltage Busbar)
- C1020 (UPS/Input-Output)
- Tin-Plated Copper Bar (Cabinet Busbar)
- Large-Section Oxygen-Free Copper Bar (HVDC)
- C1100/C1020 (liquid-cooled baseplate, chip microchannel)
- Special-shaped oxygen-free copper bar (3DVC)
.webp "Enameled wire")
Enameled wire
- 200-grade enameled wire (transformer winding)
- 200-grade enameled flat wire (power inductor)
- 180-grade enameled wire (filter inductor)
.webp "Copper strip")
Copper strip
- C7025 Copper-Nickel-Silicon Alloy (Terminal Spring)
- C194 Copper-Iron Alloy (Contact Terminal)
- C2680 Brass Alloy (Connector)
- C5210 Phosphor Bronze Alloy (EMI)
- C1020 (VC Isothermal Plate)
- C1100 (Chip Cover/Base Plate)
.webp "Copper tube")
Copper tube
- C1020 Oxygen-Free Copper Tube (Heat Pipe / 3DVC / Serpentine Flow Channel)
- C1100 Pure Copper Tube (Heat Exchanger)
.webp "Copper rod")
Copper rod
- C3604 Leaded Brass (Connector Housing)
- C5210 Copper-Iron Alloy (Spring Valve Core)
.webp "Copper wire")
Copper wire
- Silver-plated copper stranded wire (cable)
- Tin/Silver-plated copper wire (braided mesh)
