SF-Cu Copper

Designation

SF-Cu (Phosphorus-Deoxidized Copper)

International Standards: DIN 1708 2.0090, GB/T 2059-2000, CW004A (EN 13601).

Key Features

1. High Purity: Cu ≥99.90%, P 0.005–0.040%, O ≤0.03%, total impurities ≤0.05%.

2. Superior Conductivity: Electrical conductivity 57.0–58.0 Ω*mm²/m (annealed state).

3. Hydrogen Embrittlement Resistance: Low oxygen content prevents hydrogen disease.

4. Workability: Excellent cold/hot working performance (drawing, forging).

5. Corrosion Resistance: Stable in chemical and marine environments.

Product Forms & Dimensions

Form	Dimensions
Rod	Diameter: 10–300mm; Length: 2000–6000mm
Tube	OD: 5–200mm; Wall Thickness: 0.5–10mm
Sheet/Strip	Thickness: 0.1–80mm; Width: 100–1200mm
Wire	Diameter: 0.05–10mm; Custom lengths
Foil	Thickness: 0.005–0.5mm; Width: 10–500mm
Custom profiles available (e.g., lead frames).

Chemical Composition (%)

Element	Cu	P	O	Total Impurities
Content	≥99.90%	0.005–0.040%	≤0.03%	≤0.05%
Typical impurities (%): Pb≤0.005, Fe≤0.005, S≤0.005.

Physical Properties

Property	Value
Density	8.94 g/cm³
Melting Point	1083°C
Thermal Conductivity	385 W/(m·K)
Electrical Conductivity	57.0–58.0 Ω*mm²/m
Resistivity	1.724×10⁻⁸ Ω·m
Thermal Expansion	17.7×10⁻⁶/K（20–100°C）
Data based on DIN 17672-1-1983.

Mechanical Properties

Condition	Tensile Strength (MPa)	Yield Strength (MPa)	Elongation (%)	Hardness (HV)
Annealed	200–250	≤100	≥36	55
Half-Hard	240–300	≥160	≥14	80
Hard	290–360	≥250	≥8	95
Data based on DIN 17672-1-1983.

Core Advantages

1. High Conductivity & Hydrogen Resistance: Ideal for vacuum devices and H₂ brazing.

2. Precision Machining: Fine-grained structure minimizes deformation.

3. Thermal Stability: Suitable for high-temperature applications (up to 920°C).

Applications

• Mold Manufacturing: Stamping dies, plastic molds (high surface finish).

• Power Transmission: HV cable conductors, busbars.

• Chemical Equipment: Corrosion-resistant pipes, heat exchangers.

• Vacuum Devices: Magnetron anodes, traveling-wave tubes.

Processing Guidelines

1. Cold Working: Anneal at 500–700°C (under N₂/Ar protection).

2. Hot Working: Temperature range 750–875°C, final rolling ≥600°C.

3. Welding: Avoid reducing atmospheres >370°C; use silver-based filler.

Key Application Scenarios

Industry	Typical Components	Requirements
Mold Manufacturing	Stamping dies	High surface precision, fatigue resistance
Power Transmission	HV cable conductors	High current capacity, low resistance
Vacuum Industry	Magnetron anodes	Low gas emission, high-temperature brazing

FAQ

Q1: How does SF-Cu compare to ETP copper?

A1: SF-Cu has controlled phosphorus (0.005–0.040%) for enhanced hydrogen resistance.

Q2: How to store SF-Cu materials?

A2: Store in dry environments (≤40% RH) to prevent oxidation.

Standards

Standard	Scope
DIN 1708	Chemical composition & codes
GB/T 2059	Chinese specifications for sheets/strips
EN 13601	European rod/wire technical conditions
ASTM B152	U.S. specifications for sheet/strip

Note: Actual parameters may vary depending on manufacturing processes.