SE-Cu Copper

Designation

SE-Cu (Phosphorus-Deoxidized Copper)

• International Standards: DIN 1708 2.0070, EN 13601 Cu-OF

• Alternate names: CW021A, Cu-HCP R240

Key Features

1. High Purity: Cu ≥99.90%, P ≤0.003%, O ≤0.03%.

2. Superior Conductivity: Electrical conductivity ≥57.0 Ω*mm²/m (annealed).

3. Hydrogen Embrittlement Resistance: Low oxygen content prevents hydrogen disease.

4. Workability: Suitable for cold/hot working (drawing, forging, stamping).

5. Corrosion Resistance: Stable in harsh environments (chemical, marine).

Product Forms & Dimensions

Form	Dimensions
Rod	Diameter: 10–300mm; Length: 2000–6000mm
Tube	OD: 5–200mm; Wall Thickness: 0.5–10mm
Sheet/Strip	Thickness: 0.1–80mm; Width: 100–1200mm
Wire	Diameter: 0.05–10mm; Custom lengths
Foil	Thickness: 0.005–0.5mm; Width: 10–500mm
Custom profiles available (e.g., lead frames)

Chemical Composition (%)

Element	Cu	P	O	Total Impurities
Content	≥99.90%	≤0.003%	≤0.03%	≤0.05%
Typical impurities (%): Pb≤0.005, Fe≤0.005, S≤0.005

Physical Properties

Property	Value
Density	8.94 g/cm³
Melting Point	1083°C
Thermal Conductivity	385 W/(m·K)
Electrical Conductivity	≥57.0 Ω*mm²/m
Resistivity	1.724×10⁻⁸ Ω·m
Thermal Expansion	17.7×10⁻⁶/K（20–100°C）

Mechanical Properties

Condition	Tensile Strength (MPa)	Yield Strength (MPa)	Elongation (%)
Annealed	200–250	60–80	≥40
Hard	350–420	330–380	2–8
Reference: Longitudinal room-temperature properties

Core Advantages

1. High Conductivity & Hydrogen Resistance: Ideal for vacuum devices and H₂ brazing.

2. Thermal Stability: Recrystallization temperature up to 300°C.

3. Precision Machining: Fine-grained structure reduces deformation.

Applications

• Power Industry: Cables, busbars, transformer windings.

• Electronics: IC lead frames, vacuum tube components.

• Chemical Equipment: Evaporators, corrosion-resistant pipes.

• Aerospace: Waveguide components, engine cooling tubes.

Processing Guidelines

1. Cold Working: Anneal at 500–700°C (under N₂/Ar protection).

2. Hot Working: Temperature range 750–875°C, final rolling ≥600°C.

3. Welding: Avoid reducing atmospheres >370°C; use silver-based filler.

Key Application Scenarios

Industry	Typical Components	Requirements
Power Transmission	HV cable conductors	High current capacity, arc resistance
Vacuum Devices	Magnetron anodes	Low gas emission, high-temperature brazing
Renewable Energy	Solar collector plates	Corrosion resistance, thermal conductivity

FAQ

Q1: Difference between SE-Cu and ETP copper?

A1: SE-Cu has lower oxygen (≤0.03%) and added phosphorus, preventing hydrogen embrittlement.

Q2: How to store SE-Cu?

A2: Store in dry, low-humidity environments (≤40% RH) to prevent oxidation.

Standards

Standard	Scope
DIN 1708	Chemical composition & codes
EN 13601	Rod/wire technical conditions
GB/T 5231	Chinese copper classifications

Note: Actual parameters may vary depending on manufacturing processes.