Cu-HCP is a deoxidized, oxygen-free copper with a low residual phosphorus content. It combines very good formability, weldability and brazing with high electrical conductivity (minimum 98% IACS).
Cu-HCP | Cu | PB | Bi | P | Others |
99.95 | max 0.005 | max 0.0005 | 0.002 - 0.007 | total 0.03 |
Electrical engineering, power module substrates, process equipment manufacturing and cable industry.
Tensile strength | 200 |
Yield strength | 50 |
Minimum elongation at break | 30 |
Hardness | 40 |
Resistivity | 0.01754 - 0.01818 Ω*mm²/m |
Melting point | Density | cp@20°C | Coefficient of Thermal Expansion | Young modulus |
1083°C | 8.94g/cm³ | 0.377kJ/kgK | 17.7 10-6 /K | 127 GPa |
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